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DOI will be assigned to every published paper at no additional charge. 📢 Call for Papers — Volume 13, Issue 10 (October 2026) | Submission Deadline: October 26, 2026 | Rapid peer review: 2–3 days | Impact Factor: 7.37 (SJIF 2026)

Paper Details

📄 IJAERD-OJS-3555

DESIGN ANALYSIS AND FABRICATION OF COPPER PATCH PANEL

Author(s):N.Sree Rinitha, Dr.Srinivasan, Dr.Venugopal Reddy
Institution:CAD/CAM, JNTUA COLLEGE OF ENGINEERING, PULIVENDULA
Published In:Vol. 4, Issue 8 — August 2017
Page No.:634-644
Domain:Engineering
Type:Research Paper
ISSN (Online):2348-4470
ISSN (Print):2348-6406
Abstract

Patch panels are passive components along with structured cabling system (SCS) that are integral units of datacenters in buildings and these components support the transfer of huge volume of information from source to end users.Patch panels have many advantages such as space saving, Reduce cable congestion, Ease of maintenance, Flexibility andscalability due to the high cost its usage has been restricted. The objective of the present research work is to reduce the costof patch panel for that patch panel is designed by using the 3D modeling software i.e., solid modeling of patch panel forRJ45 connector has been carried out by using the creo parametric 2.0software.In the new design plastic molding parts are tobe replaced and to maintain the same mechanical properties and functional conditions. Finite element analysis of the patchpanel is carried out by using the Ansys14.5 software and fabrication of the patch panel is to be done according to theISO8015 standards. The comparison of the cost of patch panels shows that some 65% cost saving is possible by maintain thesame mechanical properties.

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🕮 How to Cite

N.Sree Rinitha, Dr.Srinivasan, Dr.Venugopal Reddy, “DESIGN ANALYSIS AND FABRICATION OF COPPER PATCH PANEL”, International Journal of Advance Engineering and Research Development (IJAERD), Vol. 4, Issue 8, pp. 634-644, August 2017.

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Vol. 13 | Issue 10
October-2026